12671-20E, EPO-TEK H20E ADHESIVE
EPO-TEK® H20E
EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system for chip/electronic bonding in microelectronic and optoelectronic as well as SEM mounting applications. Used extensively for themal management applications due to its high thermal conductivity.
- EPO-TEK® H20E features high thermal conductivity, and is very well suited for extensive high temperature applications (300-400°C)
- Extremly reliable conductive adhesive choice for new and old applications
- H20E contains no solvents and will not outgas
- When cured, H20E is resistant to solvents, resin and moisture
- Long Pot life (2½ days)
- Shelf life is one year when store at 23°C
€408.85
SKU
EMS_12671-20E
Maximum Bond Line Cure Schedule:
| 175°C | 45 seconds |
| 150°C | 5 minutes |
| 120°C | 15 minutes |
| 80°C | 3 hours |
Typical properties:
(To be used as a guide only, not as a specification. Data below is NOT guaranteed. Different batches, conditions and applications yield differing results; Cure condition: 150°C/1 hour; *denotes test on lot acceptance basis)
Physical Properties |
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| *Color: | Part A: silver; Part B: silver | |
| *Consistency: | Smooth, thixotropic paste | |
| *Viscosity (@ 100 RPM / 23°C): | 2,200-3,200 cPs | |
| Thixotropic Index: | 4.63 | |
| Glass Transition Temp (Tg): | ≥80°C (Dynamic cure 20 – 200°C / ISO 25 Min; Ramp -10 to 200°C @ 20°C/Min) | |
| Coefficient of Thermal Expansion (CTE): | Below Tg: 31 x 10-6 in/in/°C Above Tg: 158 x 10-6 in/in/°C |
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| Shore D hardness: | 75 | |
| Lap Shear Strength @ 23°C: | 1,475 psi | |
| Die Shear Strength @ 23°C: | >10 kg / 3,400 psi | |
| Degradation Temp (TGA): | 425°C | |
| Weight Loss: |
@ 200°C: 0.59% |
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| Operating Temp: | Continuous: -55°C to 200°C Intermittent: -55°C to 300°C |
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| Storage Modulus @ 23°C: | 808,700 psi | |
| Ions: | Cl- 73 ppm Na+ 2 ppm |
NH4+ 98 ppm K+ 3 ppm |
| *Particle Size: | ≤45 microns | |
Electrical Properties |
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| *Volume Resistivity @ 23°C: | ≤0.0004 Ohm-cm | |
Thermal Properties |
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| Thermal Conductivity: | 2.5 W/mK, Based on standard method: Laser Flash | |
| 29 W/mK, Based on Thermal Resistance Data: R = L x K-1 x A-1 | ||
| Thermal Resistance: (Junction to Case): | TO-18 package with nickel-gold metallized 20 x 20 mil chips and bonded with EPO-TEK H20E (2 mils thick) EPO-TEK®H20E: 6.7 to 7.0°C/W Solder: 4.0 to 5.0°C/W |
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| Manufacturer | Electron Microscopy Sciences |
|---|---|
| Size / Rxns Number: | No |
| Protocol & Manual | No |
| Technical Tips | No |
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