12672-20S, EPO-TEK H20S ADHESIVE
EPO-TEK® H20S
EPO-TEK® H20S is a modified version of Epo-Tek®H20E. Epo-Tek® H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency (mixing ratio 1:1). This modified version offers high electrical conductivity, short curing cycles, proven reliability, and the convenient mix ratio, Epo-Tek® H20S is extremely simple to use. Epo-Tek® H20S pot life is 2.5 days and shelf life is one year when store at room temperature.
€552.50
SKU
EMS_12672-20S
Maximum Bond Line Cure Schedule:
| 175°C | 45 seconds |
| 150°C | 5 minutes |
| 120°C | 15 minutes |
| 100°C | 45 minutes |
| 80°C | 90 minutes |
Typical properties: (to be used as a guide only, not a specification)
| Physical Properties: | ||
| Color: | Part A: silver Part B: silver |
|
| Consistency: | Smooth, thixotropic paste | |
| Viscosity (@ 100 RPM / 23°C): | 1,800-2,800 cPs | |
| Thixotropic Index: | 5 | |
| Glass Transition Temp (Tg): | ≥80°C (Dynamic cure 20 – 200°C / ISO 25 Min; Ramp -10 to 200°C @ 20°C/Min) | |
| Coefficient of Thermal Expansion (CTE): | Below Tg: 31 x 10-6 in/in/°C Above Tg: 120 x 10-6 in/in/°C |
|
| Shore D hardness: | 57 | |
| Lap Shear Strength @ 23°C: | 1,240 psi | |
| Die Shear Strength @ 23°C: | ≥5 kg / 1,700 psi | |
| Degradation Temp (TGA): | 414°C | |
| Weight Loss: | @ 200°C: 0.40% @ 250°C: 0.60% @ 300°C: 1.37% |
|
| Operating Temp: | Continuous: -55°C to 200°C Intermittent: -55°C to 300°C |
|
| Storage Modulus @ 23°C: | 339,720 psi | |
| Ion: | Cl- 162 ppm Na+ 0 ppm |
NH4+ 282 ppm K+ 4 ppm |
| Particle Size: | ≤20 microns | |
| Electrical Properties: | ||
| Volume Resistivity @ 23°C: | ≤0.0005 Ohm-cm | |
| Thermal Properties: | ||
| Thermal Conductivity: | 3.25 W/mK | |
| Manufacturer | Electron Microscopy Sciences |
|---|---|
| Size / Rxns Number: | No |
| Protocol & Manual | No |
| Technical Tips | No |
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